Integrated Prepress: Do-able and DIY with Bundles from Epson and Kodak

As everyone knows, a press is built to do all of the things that a press is supposed to do: it prints, coats, dries or cures, and delivers on one self-contained platform. The same is true of postpress equipment: one machine, one complete set of capabilities.

Prepress systems, however, are another story. Because computer-to-plate (CTP) and proofing setups have to be assembled from multiple devices and corresponding arrays of supporting software, “turnkey” seldom is the word that applies to getting them up and running.

Nevertheless, out-of-the-box prepress is possible―and with bundled systems from xpedx, Epson America and the Kodak Graphic Communications Group, it’s available right now. These full-function packages provide everything needed to add end-to-end digital proofing and plating capabilities or to upgrade existing prepress workflows. Fully supported by their manufacturers, the bundles are designed for easy installation and flexible operation by printers of all sizes and production profiles.

Dipping a Toe into the Mailstream—and Discovering That the Water's Fine

Eight out of 10 times when we say “printing,” we should also be saying “mailing” in the same breath.

That, according to Dennis Killion, is what xpedx found out when it looked into what ultimately happens to the pieces its customers are printing. About 80% of that output goes—you guessed it—into the mailstream, where the printer’s profit connection with the work abruptly ceases.

But it doesn’t have to be that way, says Killion, director of marketing, graphics, for xpedx. With the help of Secap mailing solutions now available from xpedx, printers can capture and capitalize on that portion of the work as well.

A properly equipped mailing capability expands the service portfolio and augments the revenue stream. But, the best part is that it comes with a built-in and highly receptive clientele—the accounts that the printing company already is serving.

One Size Fits All: xpedx Gets Ready for Print 09

For many vendors, exhibiting at a printing trade show is all about making a big, splashy statement, and there’s nothing wrong with that. But for a different angle on what can be accomplished at an event like Print 09, consider how xpedx will present itself in booth 1221 at Chicago’s McCormick Place.

The 12,000-sq.-ft. stand will be the largest trade fair installation that xpedx has ever produced. Packed with equipment and brimming with useful information about the entire xpedx portfolio, it will serve as an all-in-one hub for the thousands of visitors expected to stream through it during the six days (Sept. 11-16) of the show.